WIRELESS MCU MODULE

The M.2 LGA form module is built with the nRF5340 SoC, which features dual ARM Cortex-M33 secure processor cores with support for Bluetooth, Thread, and Zigbee wireless technologies. It also has 512KB SRAM, 1MB Flash, and an additional 2MB QSPI external Flash. The module is designed with a DC/DC power system inside and is built in the M.2 LGA form factor, making it easy to integrate into various embedded systems.

 Wireless Technology support Bluetooth Low Energy, ANT™, and 802.15.4 for, among others, Thread and Zigbee protocols. It also allows the implementation of proprietary 2.4 GHz protocols.

RF Power for application (max)

• EIRP: < 9.8 dBm
• TX: < +6.5dBm

• Operation Temperature: –40 ~ + 105°C
• With Front-End-Module(FEM)
• Built-in 2MB QSPI Flash support data log or DFU function
• Built-in RC RT Crystal, or external 32.768KHz
• FCC/CE/IC/TELEC/NBTC/RCM/NCC & Bluetooth CERTIFICATION
•  Wireless Technology Supported, Bluetooth5/Thread/Zigbee, Bluetooth Long Range

• ARM Cortex-M33 DUAL CORE
• Application Core – 128/64Mhz
• Network Core – 64MHz
• APP CORE Data Buffer - 1MB Flash + 512KB SRAM + 2MB QSPI Flash
• NET CORE Data Buffer - 256 KB Flash + 64 KB RAM
• Arm TrustZone CryptoCell™-312 security subsystem
• GPIO: 45 Configurable Pins
• OS: ZephyrOS

• USB
• 12 bits ADC
• SPI
• I2C
• I2S
• PDM
• UART
• PWM

• 12 x 16 x 2.0 mm

The M.2 KEY E form module is built with the nRF5340 SoC, which features dual ARM Cortex-M33 secure processor cores with support for Bluetooth, Thread, and Zigbee wireless technologies. It also has 512KB SRAM, 1MB Flash, and an additional 2MB QSPI external Flash. The module is designed with a DC/DC power system inside and is built in the M.2 LGA form factor, making it easy to integrate into various embedded systems.

 Wireless Technology support Bluetooth Low Energy, ANT™, and 802.15.4 for, among others, Thread and Zigbee protocols. It also allows the implementation of proprietary 2.4 GHz protocols.

RF Power for application (max)

• EIRP: < 9.8 dBm
• TX < +6.5dBm

• Operation Temperature: –40 ~ + 105°C
• Built-in RC RT Crystal, or external 32.768KHz
• FCC/CE/IC/TELEC/NBTC/RCM/NCC & Bluetooth CERTIFICATION
•  Wireless Technology Supported, Bluetooth5/Thread/Zigbee, Bluetooth Long Range

• ARM Cortex-M33 DUAL CORE
• Application Core – 128/64Mhz
• Network Core – 64MHz
• APP CORE Data Buffer - 1MB Flash + 512KB SRAM + 2MB QSPI Flash
• NET CORE Data Buffer - 256 KB Flash + 64 KB RAM
• Arm TrustZone CryptoCell™-312 security subsystem
• GPIO: 45 Configurable Pins
• OS: ZephyrOS

• USB
• 12 bits ADC
• SPI
• I2C
• I2S
• PDM
• UART
• PWM

• 22 x 30 x 3.6 mm

nRF5340, ARM Cortex-M33 secure processor core with Bluetooth/Thread/Zigbee wireless technology, 512KB SRAM, 1MB Flash was built-in tiny LGA module for space-constrained applications.

The tiny LGA module is built with the ARM Cortex-M33 secure processor core and supports Bluetooth, Thread, and Zigbee wireless technologies. It has a 512KB SRAM, 1MB Flash, and is designed to operate within a wide temperature range of -40 ~ +105 °C. This module is suitable for a variety of sensor and actuator applications where space is limited and reliable wireless communication is essential.

RF Power for application (max)

• EIRP: < 9.8 dBm
• TX < +6.5dBm (JP), < +2.5 dBm (Others)

• Operation Temperature: –40 ~ + 105°C
• Built-in RC RT Crystal, or external 32.768KHz
• FCC/CE/IC/TELEC/NBTC/RCM/NCC & Bluetooth CERTIFICATION
•  Wireless Technology Supported, Bluetooth5/Thread/Zigbee, Bluetooth Long Range

• ARM Cortex-M33 DUAL CORE
• Application Core – 128/64Mhz
• Network Core – 64MHz
• APP CORE Data Buffer - 1MB Flash + 512KB SRAM
• NET CORE Data Buffer - 256 KB Flash + 64 KB RAM
• Arm TrustZone CryptoCell™-312 security subsystem
• GPIO: 45 Configurable Pins
• OS: ZephyrOS

• USB
• 12 bits ADC
• SPI
• I2C
• I2S
• PDM
• UART
• PWM

• 8 x 10 x 1.6 mm