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    • Home
    • TECH
      • Device Management
      • Bluetooth Mesh Profile
      • Modbus and PoE
      • Wireless MCU Module
    • Product
      • ABR-A01 Platform
      • Wireless MCU Modules
    • Company
      • About
      • Partners
      • Investor
    • Lang
      • JP
    • OnLine Store

  • Home
  • TECH
    • Device Management
    • Bluetooth Mesh Profile
    • Modbus and PoE
    • Wireless MCU Module
  • Product
    • ABR-A01 Platform
    • Wireless MCU Modules
  • Company
    • About
    • Partners
    • Investor
  • Lang
    • JP
  • OnLine Store

WIRELESS MCU MODULE

ABR-WM01-LGA

nRF5340, ARM Cortex-M33 secure processor core with Bluetooth/Thread/Zigbee wireless technology, 512KB SRAM, 1MB Flash was built-in tiny LGA module for space-constrained applications.

Wireless Technology

The tiny LGA module is built with the ARM Cortex-M33 secure processor core and supports Bluetooth, Thread, and Zigbee wireless technologies. It has a 512KB SRAM, 1MB Flash, and is designed to operate within a wide temperature range of -40 ~ +105 °C. This module is suitable for a variety of sensor and actuator applications where space is limited and reliable wireless communication is essential.

  

RF Power for application (max)

  • EIRP: < 9.8 dBm
  • TX < +6.5dBm (JP), < +2.5 dBm (Others)

Main Feature

  • Operation Temperature: –40 ~ + 105°C
  • Built-in RC RT Crystal, or external 32.768KHz
  • FCC/CE/IC/TELEC/NBTC/RCM/NCC & Bluetooth CERTIFICATION
  •  Wireless Technology Supported, Bluetooth5/Thread/Zigbee, Bluetooth Long Range

Core Processer & Embedded System

  • ARM Cortex-M33 DUAL CORE
  • Application Core – 128/64Mhz
  • Network Core – 64MHz
  • APP CORE Data Buffer - 1MB Flash + 512KB SRAM
  • NET CORE Data Buffer - 256 KB Flash + 64 KB RAM
  • Arm TrustZone CryptoCell™-312 security subsystem
  • GPIO: 45 Configurable Pins
  • OS: ZephyrOS

Interfaces

  • USB
  • 12 bits ADC
  • SPI
  • I2C
  • I2S
  • PDM
  • UART
  • PWM

Form Factor

  • 8 x 10 x 1.6 mm

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